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Facility
[Furnace] Rapid thermal process(non O2)
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2016-03-25 17:46:57
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Á¦ÀÛȸ»ç : ULTECH
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¿ëµµ : RTA(Rapid Thermal Annealing)
Ư¡ :
-Wafer size : Á¶°¢ ~4"
-Substrate heater : Max. 1000¡É
-Ultimate pressure : ¡Â 2 ¡¿ 10-3Torr
-Process control : Manual process control
´ã´çÀÚ : ÀÓÁØÀÏ, ÀÌÀμö
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Probe station1
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Conventional Vertical Furnace