13 |
Ȳö¼º, ±è°æ¹Î °í¼Ó ½ºÀ§Äª ÀúÇ× º¯È ±â·Ï¼ÒÀÚ ¹× ÀúÇ× º¯È ±â·Ï¼ÒÀÚ ½ºÀ§Äª ¹æ¹ý ´ëÇѹα¹, 10-1034838, 2009. 12. 08. |
|
12 |
Ȳö¼º »êȹ° ¹ÝµµÃ¼ ä³ÎÀ» °®´Â ³½µå Ç÷¡½Ã ¸Þ¸ð¸® ¼ÒÀÚ ´ëÇѹα¹, 10-1075077, 2009. 11. 30. |
|
11 |
Ȳö¼º, ÃÖ¼³, ¾öÅ¿ë Ä®ÄÚÁ¦³ªÀ̵å°è ¹Ú¸· ¿¡Äª¹æ¹ý ¹× Ä®ÄÚÁ¦³ªÀ̵å°è ¹Ú¸· ÁõÂøÀåÄ¡ Ŭ¸®´× ¹æ¹ý ´ëÇѹα¹, 10-1079634, 2009. 11. 04.
|
|
10 |
Ȳö¼º, ÃÖ¼³, ¾öÅ¿ë Ä®ÄÚÁ¦³ªÀ̵å°è ¹Ú¸· ÁõÂø¹æ¹ý ´ëÇѹα¹, 10-1071251, 2009. 11. 04.
|
|
9 |
Cheol-Seong Hwang, Hyun-Ju Lee DIELECTRIC FILM,METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR CAPACITOR HAVING THE DIELECTRIC FILM ¹Ì±¹, 07575940 B2, 2009. 08. 18.
|
|
8 |
Jin Yong Ahn, Cheol Seong Hwang, Sung Kun Kim, Chang Sup Ryu, Suk-Hyeon Cho, Ho Sik Jeon Printed circuit board with embedded capacitors therein and manufacturing process thereof ¹Ì±¹, 07564116, 2009. 07. 21. |
|
7 |
Ȳö¼º £Ç£Ó£Ô ³ª³ëÁ¡À» ÀÌ¿ëÇÑ ÀüÇÏ Æ®·¦ Ç÷¡½Ã ±â¾ï¼ÒÀÚ ´ëÇѹα¹, 10-1003451, 2009. 07. 20. |
|
6 |
Ȳö¼º, ÃÖº´ÁØ, ±è°æ¹Î ÀúÇ׺¯È±â·Ï¼ÒÀÚ, ±× Á¦Á¶¹æ¹ý, Á¤º¸±â·Ï¹æ¹ý ¹× Á¤º¸Æǵ¶¹æ¹ý ´ëÇѹα¹, 10-0905420, 2009. 06. 24.
|
|
5 |
Ȳö¼º, ¼®ÁØ¿µ ÀúÇ× º¯È ·£´ý ¾×¼¼½º ¸Þ¸ð¸® ¹× ÀúÇ× º¯È ·£´ý ¾×¼¼½º ¸Þ¸ð¸®ÀÇ Á¤º¸ ±â·Ï ¹æ¹ý°ú Á¤º¸ Æǵ¶ ¹æ¹ý ´ëÇѹα¹, 10-1079662, 2009. 06. 08. |
|
4 |
Ȳö¼º ¹ÝµµÃ¼ ¼ÒÀÚÀÇ ½ºÅ丮Áö ³ëµå Çü¼º ¹æ¹ý ´ëÇѹα¹, 10-1036451, 2009. 06. 08.
|
|