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11

Young-soh Park Sang-in Lee, Cheol-seong Hwang, Doo-sup Hwang, Hag-Ju Cho

Methods of forming integrated circuit capacitors using metal reflow techniques

¹Ì±¹, 06001660, 1999. 12. 14.

10

Ȳö¼º, ÀÌÃáÈ£

»êȭƼź¸¶±×³×½· ¹Ú¸·À» ÀÌ¿ëÇÑ FRAM ¹× FFRAM ¼ÒÀÚ

´ëÇѹα¹, 10-0238210, 1999. 10. 13.

9

¹Ú¿µ¼Ò, ÀÌ»óÀÎ, Ȳö¼º, ȲµÎ¼·, Á¶ÇÐÁÖ

¹é±ÝÁ· ±Ý¼ÓÃþ Çü¼º¹æ¹ý ¹× À̸¦ ÀÌ¿ëÇÑ Ä¿ÆнÃÅÍ Á¦Á¶ ¹æ¹ý

´ëÇѹα¹, 10-0230418, 1999. 08. 23.

8

Ȳö¼º, ÀÌÁ¾¸í

¿äöÇü ±Ý¼Ó¸·°ú ±× Çü¼º ¹æ¹ý, ¿äöÇü Àü±Ø ¹× À̸¦ ÀÌ¿ëÇÑ Ä³ÆнÃÅÍÀÇ Á¦Á¶ ¹æ¹ý

´ëÇѹα¹, 10-0230361, 1999. 08. 23.

7

Byong-taek Lee and Cheol-seong Hwang

Method of forming floating-gate FFRAM devices

¹Ì±¹, 05940705, 1999. 08. 17.

6

±èÁø¿ø, Ȳö¼º, ÀÌ»óÀÎ

¹ÝµµÃ¼ ¼ÒÀÚÀÇ ÄÜÅà ¹è¼± ¹æ¹ý ¹× À̸¦ ÀÌ¿ëÇÑ Ä³ÆнÃÅÍ Á¦Á¶ ¹æ¹ý

´ëÇѹα¹, 10-0227843, 1999. 08. 05.

5

Ȳö¼º

¹ÝµµÃ¼ ¸Þ¸ð¸® ¼ÒÀÚÀÇ Á¦Á¶ ¹æ¹ý

´ëÇѹα¹ ƯÇã(°ø°³), 1999-72019, 1999. 07. 15.

4

Ȳö¼º, À̺´ÅÃ

¹ÝµµÃ¼ ÀåÄ¡ÀÇ °­À¯Àüü Ä¿ÆнÃÅÍ ¹× ±× Á¦Á¶ ¹æ¹ý

´ëÇѹα¹, 10-0224729, 1999. 07. 15.

3

Jin-Won Kim, Cheal-Seong Hwang, Sang-in Lee

Dual deposition methods for forming contact metallizations, capacitors, and memory  devices

¹Ì±¹, 05918118, 1999. 06. 29.

2

À̺´ÅÃ, Ȳö¼º

Æä·ÎÀÏ·ºÆ®¸¯ Ç÷ÎÆà °ÔÀÌÆ® ·¥À» ±¸ºñÇÏ´Â ¹ÝµµÃ¼ ¸Þ¸ð¸® µð¹ÙÀ̽º ¹× ±× Á¦Á¶ ¹æ¹ý Çѱ¹

´ëÇѹα¹, 10-0219519, 1999. 06. 16.