¢ßÇöóÁƮ´Â ¹ÝµµÃ¼, µð½ºÇ÷¹ÀÌ, ¹ÙÀÌ¿À, µîÀ» ºñ·ÔÇÏ¿© ³ª³ë(NT) ºÐ¾ß¿¡ À̸£±â±îÁö ´Ù¾çÇÑ ºÐ¾ß¿¡¼ 10 ³â ÀÌ»ó ÃàÀûµÈ ÇöóÁ ¿øõ ±â¼úÀ» º¸À¯ÇÑ ÇöóÁ Àü¹®±â¾÷ÀÔ´Ï´Ù. MINIPLASMA-station (R&D¿ë Plasma System) 1. Á¦Ç° °³¿ä: 10¿©³â ÀÌ»ó ÃàÀûµÈ ÇöóÁ ¹ß»ý ¹× Á¦¾î ±â¼ú, ÇöóÁ Áø´Ü ±â¼úÀ» ¹ÙÅÁÀ¸·Î CCP(PE, RIE type), ICP, Remote Plasma, µîÀ» ÇϳªÀÇ Àåºñ¿¡¼ Æí¸®ÇÏ°Ô ¸ðµâ¸¸ ±³Ã¼ÇÔÀ¸·Î½á ´Ù¾çÇÑ ÇöóÁ ȯ°æÀ» ºü¸£°í ½±°Ô ±¸ÇöÇÏ¿© ÁõÂø, ½Ä°¢, Ç¥¸éó¸®, µîÀÇ °øÁ¤À» Á¦°øÇÏ´Â ´Ù¸ñÀû ÇöóÁ ½Ã½ºÅÛ 2. ³³Ç° ½ÇÀû(ÃÖ±Ù ±âÁØ): - ³³Ç°Ã³: KIMM, Ç¥ÁØ°úÇבּ¸¿ø, ±¸¹ÌÀüÀÚ±â¼ú¿¬±¸¼Ò, KAIST, ±¤ÁÖ°úÇбâ¼ú¿ø, ¹ÝµµÃ¼ Àåºñ±â¼ú±³À°¼¾ÅÍ, Çѱ¹Ç×°ø´ëÇб³ µð½ºÇ÷¹À̼¾ÅÍ, ¼º±Õ°ü´ëÇб³, ÇѾç´ëÇб³, ¼¼Á¾´ëÇб³, ºÎ»ê´ëÇб³, µî - ³³Ç° ¿¹Á¤: ¼º±Õ°ü´ëÇб³, KIST, ±¸¹ÌÀüÀÚÁ¤º¸±â¼ú¿ø, µî- ½Ã½ºÅÛ type: ICP-CVD, PECVD, ICP&RIE, RIE, Sputtering System, µî- Àû¿ë ºÐ¾ß: Semiconductor, Nano, FPD, Bio, µî3. ÀÀ¿ëºÐ¾ß: Plasma Surface Treatment Nano Application Bio Application Plasma Polymerization Semiconductor Process FPD Process MEMS4. ±â¼ú ÇöȲ ¹× °æÇè- ±¹³» ¾÷ü Áß¿¡¼ Plasma Sources (ÇöóÁ ¹ß»ý ÀåÄ¡) Ãִ٠ƯÇã Ãâ¿ø ¹× µî·Ï (¾à 30°Ç)- ¾ç»ê¿ë ÇöóÁ °ü·Ã ½Ã½ºÅÛ Á¦Á¶ ¾÷ü Consulting- ´ëÇб³ ¹× ¿¬±¸¼Ò¿¡¼ ÇöóÁ ¹× Á¦Ç° °ü·Ã ¼¼¹Ì³ª- ¹ÝµµÃ¼Àåºñ±â¼ú±³À°¼¾ÅÍ¿¡¼ ÇöóÁ °ü·Ã ±³À° ÁøÇàÇÏ°í ÀÖÀ½- ±¹³» ÃÖÃÊ·Î ÃʼÒÇü ÇöóÁ °øÁ¤ Àåºñ(MINIPLASMA-cube)Langmuir Probe System (DLP2000, SLP2000) Plasma Monitoring System (NIEA; Non-invasive Ion Energy Analyzer) RF Matcher (Digital type: Pulse Operation °¡´É) Arc Detector,µî °³¹ß ¹× °ø±Þ 5. Sample Test - ÁõÂø ¹× ½Ä°¢, Ç¥¸é ó¸®, µîÀÇ ´Ù¾çÇÑ Test- ÇöÀç ÁøÇà ÁßÀÎ Test ºÐ¾ß: ¹ÝµµÃ¼, ¹ÙÀÌ¿À, ³ª³ë, µî- ¢ßÇöóÁƮ¿¡¼ Á÷Á¢ Àåºñ¸¦ ±¸µ¿ÇÏ¿© Test °¡´É ´õ ¸¹Àº Á¤º¸¸¦ ¿øÇÏ½Ã¸é ¾ðÁ¦µçÁö ¿¬¶ô¸¸ ÁÖ¼¼¿ä!³¡±îÁö Àоî ÁÖ¼Ì¾î °¨»çÇÕ´Ï´Ù. PLASMART Inc.Manager / Sales TeamTel: +82-42-934-2545/7 (Extension Number 101)Fax: +82-42-934-2524Http://www.plasmart.com E-mail: sskang@plasmart.com
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